HDI (High Density Interconnect) PCB

Substrate or board with the Microvia of aperture below 6mil, 

Hole pad below 0.25mm,

Connect pad density above 130 points / square inch, 

Wiring density above 117 inches / square inch, 

Line width / spacing below 3mil/3mil, 

Mainly used in mobile phones, cameras, camcorders, laptops, network card, IC carrier board, military, medical and other different areas.

Specification:

1)Electronic Circuit PCB Board

2)Certificate: UL,SGS,RoHS,ISO/TS16949,ISO14001:2004

3)Base Material: High TG FR-4/FR-4/Lead Free Material(ROHS Compliant)/CEM-3/CEM-1/FR-1

4)Solder Mask: Green/Red/Yellow/Blue/Black/Customized

5)Surface Treatment: Lead Free HASL/HASL/ENIG/OSP/Customized

6)Packing Details: Vacuum+Dessicant

7)Competitive Price, High Quality

8)Fast Delivery: 5-10 working days

9)OEM Service

Our Capability

Purchase Tips:

1)Acceptable file format: GERBER file, PROTEL series, PADS series, POWER PCB series, AutoCAD series

2)Large PCB quantiy order, quotation will be based on SQM

3)Any requirement, feel free to contact us.